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Introduction
Job Vacancies
Campus Recruitment
Introduction

In order to bring more energetic and vigorous employees to speed up company's development, T3G created a sustainable development plan to meet fresh graduate's career needs, the success opportunity could be ever accessed for the youngster who will renovate the history in the future.

Job Vacancies
SW Department
Software Engineer

Job requirements:

o         Telecommunication Protocal development experience.

o        Software development experience (C, C++) in middle or big level software project.

o         Good understanding of software engineering.

o        Familiar with UNIX or LINUX operating system.

o         Embedded system development experience.

o        The knowledge of GSM, CDMA, 3PGG wireless communication standard.

Personal Attributes:

o         Good command of English

o         Master Degree in electronics Engineering or related majoring

o         Self-motivated and Good teamwork

o         To be graduated from university in Beijing is preferred.

 

Apply for this position: recruiting@t3gt.com
System Integration and Test Department
Integration Test Engineer

Key Responsibilities:

o    Draft Integrated Test Plan and Specifications.

o    Specify Test Cases and organize test.

o    Submit Test Report.

o   Cooperate with other teams or other corporation to provide concise solution to          problems.

o   Configure and maintain test environments, and investigate the use of automated       testing tools.

Job Specifications:

o    Experience in GSM/GPRS/CDMA related development.

o    Experience in Integrated/System Test.

o    Experience in Embedded Software project development/management.

o    Experience in Wireless protocol development (plus).

o    Familiar with Automatic Test Instrument, such as Protocol Simulator, Signal Analyzer,  Signal Generator and so on.

o    Strong analytical skills and problem solving skills to analyze defects to pin point the problem.

o    Good knowledge of software development cycles, including testing phases.

o    Good command of English.

o    Self-motivated and Good teamwork.

Apply for this position: recruiting@t3gt.com
Hardware Department
RF Engineer

Key Responsibilities:

o    New RF component evaluation.

o    RF sub-system design/debug/test.

o    RF system test.

Job Specifications:

o    Have some experience in RF sub-system design/debug/test.

o    Familiar with wireless communication, communication theory.

o    Good background in circuit theory including analog, digital and high frequency as well as microwave circuits.

o    Familiar with RF testers, including spectrum analyzer, RF signal generator, noise analyzer, vector network analyzer, VSA, etc.

o    Some familiar with some EDA software, such as Protel99, Cadence, Power PCB, ADS, etc.

o    Good team-working capability.

o    MA degree or above in telecommunication, electronic engineering or microwave.

Apply for this position: recruiting@t3gt.com
DSP Department
DSP Engineer

Key Responsibilities:

o       DSP design and integration test.

o        Design DSP assembler modules for the Modem of 3G mobile phone.

Job Specifications:

o        Fresh Graduate, with engineering project for the thesis.

o        Telecommunication and DSP theory, signal processing algorithm and implementation, assembler coding of DSP.

o        Open teamwork, conscientious.

o        Master in wireless Communication/Signal Processing/Electronics Engineer.

Apply for this position: recruiting@t3gt.com
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