The TD-SCDMA terminal baseband Modem IC is independently developed by T3G, based on T3G owned algorithms, and achieves excellent performance and reliability. The Modem IC features flexible interface and strong processing capabilities that are compatible with many IC components. It interfaces to the GSM/GPRS/EDGE system solutions from chipset vendors such as NXP and Motorola to support TD-SCDMA/GSM/GPRS/EDGE dual mode handset design.

At present, there are two models of Modem IC available and comply with 3GPP R4 and R5 standards respectively.

TD60186：

• Compliant with 3GPP

• PS 384 kbps DL/ 128kbps UL

• CMOS18S

•  Low power consumption
  　

Modem IC Block Diagram

The TD60186 modem IC can be used in dual mode TD-SCDMA and GGE (GSM/GPRS/EDGE) dual mode terminal design. It can also be used for wireless modules and data card design.

TD60291:

• Compliant with 3GPP R5

• Support 2.8Mbps HSDPA

• Support TD-MBMS

• CMOS090

• Low power consumption
  　

Modem IC Block Diagram

The TD60291 can be used in a high-end dual mode TD-HSDPA/GGE terminal design. It can also be used for a high-speed wireless data access module and data card design.

TD-HSDPA/GGE Dual-mode Terminal Reference Design Hardware Block Diagram