Beijing,  October 24, 2007 - The leading TD-SCDMA terminal chipset solution provider, Beijing T3G Technology Co., Ltd., today showcased the world’s first 2.8Mbps HSDPA modem IC – TD60291. As a result of this development from T3G, TD-SCDMA has moved forward very quickly towards the current W-CDMA 3G capability.

T3G’s TD60291 is a single-chip TD-SCDMA Modem IC supporting 3GPP Standard Release 5 version with the powerful capability to handle all TD-SCDMA physical layer signal processing tasks. In addition to supporting 384kbps uplink and downlink data rate, it can also support 2.8Mbps HSDPA and TD-MBMS. The IC is the outcome of a joint project between T3G and NXP, using NXP’s powerful DSP processor cores.

The TD60291 can be used in a high-end dual-mode TD-HSDPA/GSM/GPRS/EDGE+ terminal design or even in a high-speed wireless data access module and data card design.

Like the other 3G standard W-CDMA, TD-SCDMA also has evolved to provide HSDPA capability defined in the 3GPP R5 version. The TD-SCDMA 3GPP R5 specifications adopt new technologies such as AMC (automatic modulation and coding), HARQ (Hybrid Automatic Repeated Request), and FCS (Fast cell selection) to better meet the requirements of high speed mobile data services. It also uses 16QAM, a highly efficient new modulation mode that can increase the single-carrier data transmission speed to 2.8Mbps and considerably boosts the spectrum efficiency and the capacity of the TD-SCDMA network, compared with QPSK, the modulation mode used in the 3GPP R4 version.

Mr. Johan Pross, CEO of T3G said, “The release of T3G’s 2.8Mbps HSDPA chipset enables handphone makers to offer more commercialized handsets with a broad scope of 3G multimedia applications. The T3G TD60291 will greatly expand the commercial application scope of TD-SCDMA.”

Mr. Stephen Lin, Vice President & General Manager of BU Mobile & Personal at NXP Semiconductors, Greater China said, ”The availability of T3G’s 2.8Mbps chipset is a strong driving force for the industrialization and commercialization of TD-SCDMA. NXP will further enhance the cooperation with T3G to speed up the commercialization of TD-SCDMA in general and specifically boost the introduction of HSDPA before the Olympics.”

Mr. Wang Tong, President of China Samsung Telecom R&D Center said, ‘Multimedia interactive function will be the trend for the development of future handsets. T3G newly developed TD-HSDPA chipset which can support over 2Mbps data rate will enable Samsung to develop more handsets with rich multimedia and business functions.’      

Live demonstrations of T3G’s HSDPA solution will be available at the PT/EXPO China 2007 from 23-27 October at the Chinese International Exhibition center, Beijing. T3G, with its customers, will demonstrate high-speed data download and high-definition streaming applications. Users will tangibly experience the powerful performance of R5 version HSDPA.

HSDPA is an important 3GPP Release 5 feature designed to better facilitate mobile web access and video streaming applications through the provision of broadband data rates and can best demonstrate TD-SCDMA’s competitiveness as the most suitable 3G technology to deliver Internet applications characterized by asymmetric traffic requirements. Hence, the implementation of TD-SCDMA HSDPA infrastructure and devices, at the commencement of global commercial HSDPA services, is of strategic importance to increase the competitive advantages of TD-SCDMA, and to accelerate the rapid growth of the 3G mobile market.

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