The 2008 International Mobile Phone Industry Exhibition (IMIE 2008) was held in Tianjin Binhai International Convention and Exhibition Center on June 12-14, 2008. T3G participated in the exhibition and showcased its independently developed TD-SCDMA modem IC and TD-HSDPA/GSM/GPRS/EDGE dual mode terminal system solutions. Mike Mu, Director of Business Development Department of T3G attended the 2008 China Mobile Phone Industry Development (International) Summit Forum and had delivered a speech there,  entitled with TD-SCDMA Chipset Development Status & Terminal Evolution. What's more, many T3G customers' TD terminals were displayed in the exhibition as well.  

T3G Booth at Zhongguancun Haidian Park Administrative Committee Pavilion 　 　 Mike Mu, Director of T3G BD Dept. at 2008 China Mobile Phone Industry Development (International) Summit Forum 　 　 T3G Stand at TD-SCDMA Industry Aliiance Pavilion 　 　 T3G introduces company and products information to officials from Tianjin Economic Technological Development Area 　 　 T3G Customers' TD-SCDMA Terminals (left 1, right 1 and right 2)

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