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2004 News

12/27/2004	T3G Realized 128k Data Transmission on Commercial TD-SCDMA Chipset
12/09/2004	First 3G oversea call made to Prime Minister Wen by Philips using Chinese 3G standard network
12/09/2004	First TD-SCDMA/GSM Dual Mode Commercial Handset is available from Samsung by T3G chipset solution
11/11/2004	T3G Reached Worldwide TDD-LCR First Call on Commercial Handset Reference Design Platform
10/25/2004	MII Vice Minister Visited T3G Stand on PT/EXPO COMM CHINA 2004
10/18/2004	MII Official Mr. Zhang Xinsheng Inspected T3G, Congratulating on Whole System Level TDD-LCR L1/L2/L3 first Call on Modem IC
10/14/2004	T3G Makes Landmark Breakthrough in Reaching L1/L2/L3 First Call on Modem IC
10/11/2004	T3G Celebrates first Genie Modem IC Engineering Samples
08/18/2004	T3G Announces Tape Out of Modem IC for TD-SCDMA Cellular Phone
05/20/2004	T3G Chooses Incisive Verification for Its Speed and Efficiency
03/04/2004	TDIA experts made research on T3G